Package Development Engineering – Product Integration Engineer (PDE PIE)
Core
Integrate AI-assisted tools into daily work, drive New Product Introduction (NPI) processes, and act as a technical integrator across manufacturing sites to bring new semiconductor packages into volume production.
Role type
Product Integration Engineer (NPI)
Builds
New memory and storage products (DRAM, NAND, NOR) for data centers, AI, 5G, and mobile applications.
Domain
Semiconductor manufacturing and packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Advanced package assembly flows, Die stacking and thin substrates knowledge, NPI qualification frameworks, Yield analysis, Failure analysis methodologies (EFA/PFA), Process characterization and validation
Preferred skills
Semiconductor industry internship or experience, Micron industry knowledge, AI tool literacy
Technologies
None explicitly listed as tools/frameworks
Responsibilities
Integrate AI-assisted tools to improve efficiency and quality, Drive NPI Phase Gate Review and new product start-up qualification, Monitor product yield trends and reliability to initiate early attention, Drive Electrical and Physical Failure Analysis closure for NPI issues, Act as technical integrator across multiple manufacturing sites and partners, Own the entire Product Life Cycle from NPI to End of Life
Seniority
Entry-level to Mid-level (Fresh graduate encouraged)
