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DRAM Systems Architecture

Boise, ID - Main Site, US💼 Full-time💰 $177,000–$177,000🗓 2026-04-17 → 2026-09-26

Core

Define next-generation memory system architectures focusing on performance, capacity, reliability, and telemetry while leading cross-stack co-optimization from silicon to system level.

Role type

Senior technical leadership DRAM systems architect

Builds

Next-generation DRAM memory systems and platforms

Domain

Semiconductor / Memory Systems

Deliverable

production ML models | product features

Required skills

DRAM system architecture, cross-stack co-optimization (silicon/package/module/board/system), RAS design, telemetry architecture, system-to-silicon translation

Preferred skills

Technical leadership across multiple products, tier-1 customer engagement, architectural innovation adoption

Technologies

DRAM, silicon, packaging, modules, boards

Responsibilities

Define next-generation memory system builds focusing on performance, capacity, RAS, and telemetry; Lead cross-stack co-optimization spanning silicon, package, module, board, and system; Architect sophisticated RAS and telemetry features and translate system needs into silicon; Drive long-range memory technology strategy and influence industry standards; Act as a senior technical liaison to customers, executives, and partners

Seniority

Senior, hands-on IC with broad architectural ownership

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