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Engineer, HIG-HBM Product & System Engineering (Media Health Manufacturing)

Fab 10A, Singapore💼 Full-time🗓 2026-03-25 → 2026-07-31

Core

Drive Media Health manufacturing execution for next-generation High Bandwidth Memory (HBM) products, focusing on test flow development, yield improvement, and reliability optimization.

Role type

Senior IC semiconductor manufacturing engineer (HBM)

Builds

High-volume manufacturing test flows and validated HBM die/stack solutions

Domain

Semiconductor manufacturing / Memory (DRAM/HBM)

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

CMOS technology, DRAM architecture, device physics, root cause analysis, test coverage optimization, circuit debug, yield improvement, project management, technical decision making

Preferred skills

Semiconductor device/internship experience, data analysis, statistics, Python, JMP

Technologies

Verilog, CAD tools, Python, JMP

Responsibilities

Ensure optimized test coverage on HBM design architectures; Develop, validate, and qualify next-generation HBM products; Support design verification and circuit analysis using CAD/Verilog; Improve manufacturing test yields and reduce test time; Resolve root causes of manufacturing test flow, qualification, and RMA device issues; Mentor team members; Make technical decisions on risk analysis and project prioritization

Seniority

Senior, hands-on IC

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