MSH PDE PI MANAGER
Core
Leading a team of Process Integration engineers to execute High Bandwidth Memory (HBM) New Product Introduction (NPI) from early development through High Volume Manufacturing.
Role type
Senior IC Process Integration Manager (HBM NPI)
Builds
HBM memory products for data centers and AI applications
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Team leadership, NPI execution, yield ramp management, cross-functional stakeholder management, risk mitigation, resource planning, root cause analysis, process integration strategy
Preferred skills
People management, advanced packaging experience, HBM/3D-stacked technology knowledge, yield stabilization track record, data analytics familiarity
Technologies
HBM, 3D-stacked technologies, yield dashboards, automation tools
Responsibilities
Lead, coach, and develop a team of PI engineers; Own PI execution for HBM NPI programs ensuring milestone delivery; Provide technical leadership for process integration strategies and yield improvement; Act as primary PI interface to cross-functional teams including Manufacturing and Assembly/Test; Drive alignment on roles, responsibilities, and decision ownership across functions
Seniority
Senior, hands-on IC with people leadership
