MSH PDE PI MANAGER
Core
Lead a team of Process Integration engineers to execute High Bandwidth Memory (HBM) New Product Introduction (NPI) from early development through High Volume Manufacturing.
Role type
Senior IC Process Integration Manager (HBM NPI)
Builds
HBM memory products for data center and AI applications
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
People leadership, NPI execution, yield ramp management, risk mitigation, cross-functional stakeholder management, root cause analysis, resource planning, technical oversight of process integration
Preferred skills
Advanced packaging experience, HBM/3D-stacked technology background, yield stabilization track record, data analytics familiarity
Technologies
HBM, 3D-stacked technologies, yield dashboards, automation tools
Responsibilities
Lead, coach, and develop a team of PI engineers; Own PI execution for HBM NPI programs ensuring delivery against milestones; Provide technical leadership for process integration strategies and yield improvement; Act as primary PI interface to cross-functional teams including Manufacturing and Assembly/Test; Drive alignment on roles and responsibilities across functions; Integrate AI-assisted tools to improve efficiency and effectiveness
Seniority
Senior, hands-on IC with people leadership