Engineer, Process Integration PDE (Package Development Engineering)
Core
Driving process integration excellence for High Bandwidth (HBM) products during New Product Introduction (NPI) to ensure robust process readiness and yield ramp.
Role type
Process Integration Engineer (NPI)
Builds
HBM memory and storage products
Domain
Semiconductor manufacturing (HBM, DRAM, NAND)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor process flows, process integration concepts, Design of Experiments (DOEs), yield/defect/variability analysis, root cause analysis, data analysis, basic statistics
Preferred skills
JMP, Python, AI-enabled tools, digital fluency, AI literacy
Technologies
JMP, Python
Responsibilities
Execute HBM NPI PI tasks following defined procedures and phase-gate requirements, Support NPI builds through lot tracking and data collection, Perform yield and defect analysis using established methods, Work with Fab, Assembly, Test, Yield, and Quality teams on assigned integration scope, Prepare and maintain technical documentation and trackers, Support NPI-to-High Volume Manufacturing handoff activities
Seniority
Junior, entry-level IC
