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[Fab15 HVM] - Dry Etch Process Equipment Engineer

Hiroshima - Fab 15, Japan💼 Full-time🗓 2026-03-17 → 2026-09-26

Core

Establishing mass production technology and management for advanced DRAM semiconductor products, focusing on dry etch processes to improve yield, quality, and productivity.

Role type

Senior IC manufacturing process engineer (dry etch)

Builds

High-performance DRAM memory chips for data centers, AI, 5G, and mobile applications

Domain

Semiconductor manufacturing (DRAM) / Dry etch process engineering

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Problem-solving, project coordination, cross-functional collaboration, data analysis, equipment troubleshooting, process optimization

Preferred skills

Physics, chemistry, mechanical, or electrical engineering background

Technologies

Dry etch equipment, Microsoft Office (Excel, PowerPoint, Word)

Responsibilities

Improve yield and quality management systems, support new equipment installation and modification, collaborate with technicians and other engineers to drive continuous improvement, report on daily issues and long-term projects, share best practices with global production sites

Seniority

Mid-level to Senior, hands-on IC

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