New College Grad - Process Integration Engineer
Core
Optimizing semiconductor processes to improve yield, reduce costs, and enable next-generation memory devices.
Role type
Entry-level Process Integration Engineer
Builds
Advanced semiconductor processes and next-generation memory devices
Domain
Semiconductor manufacturing / Memory technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Root cause investigation, failure analysis, Design of Experiments (DOE), Statistical Process Control (SPC), Fault Detection and Classification (FDC), Failure Mode and Effects Analysis (FMEA), 8D problem solving, Material supplier management, Process validation, Technology transfer
Preferred skills
Master's or Ph.D. in relevant field, 300mm semiconductor environment internship, Semiconductor and memory technologies knowledge, Transistor and metallization processes knowledge, Yield ramp and fabrication processes knowledge
Technologies
JMP, SPC/FDC/RMS/APC systems
Responsibilities
Conduct root cause investigations and failure analysis, Drive improvements in yield, cost efficiency, and quality, Run Design of Experiments (DOE) to enhance process capability, Monitor trends and sustain line stability, Address top detractors to improve device yield and reliability, Lead workshops during technology transfer, Start up, develop, and optimize processes, Identify and resolve process-related issues using FMEA, 8D, SPC/FDC methodologies, Coordinate and execute process, equipment, and material evaluations, Validate and qualify new processes, tools, and materials, Manage and audit material suppliers, Support internal and external audits
Seniority
Entry-level, hands-on IC
