Memory Design Engineer, HBM
Core
Design and optimize digital, analog, and memory core circuits for advanced DRAM products, translating device concepts into functional, manufacturable solutions.
Role type
Memory Design Engineer (HBM/DRAM)
Builds
High-performance, cost-efficient memory products for global customers
Domain
Semiconductor / Memory / VLSI
Deliverable
production ML models | product features | infrastructure
Required skills
CMOS circuit design, VLSI, analog circuit design, circuit simulation, circuit floor planning, device reliability analysis
Preferred skills
DRAM subsystem architecture, specification, operation, or design
Technologies
FINESIM, HSPICE, VERILOG
Responsibilities
Design and optimize digital, analog, and memory core circuits using CMOS technology; Perform circuit simulations and analyses to evaluate power, performance, reliability, and parasitics; Develop circuit floorplans including placement, routing, power distribution, timing, and die size considerations; Validate designs through reticle experiments, tape-out revisions, and simulation-to-silicon correlation; Collaborate with global teams across design, verification, product engineering, test, probe, process integration, assembly, and marketing to support manufacturability, quality, and cost objectives
Seniority
Senior, hands-on IC