Memory Design Engineer, HBM
Core
Designing and analyzing digital and analog circuits for advanced memory products, specifically DRAM, from concept to silicon solution.
Role type
Senior IC memory design engineer (DRAM)
Builds
High-performance memory chips (DRAM) for silicon-to-systems solutions
Domain
Semiconductor / Memory / DRAM
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CMOS circuit design, VLSI, Analog circuit design, DRAM subsystem architecture, Circuit floor planning, Device reliability analysis
Preferred skills
Cross-department technical leadership, Industry-specific technology trends knowledge
Technologies
Cadence Virtuoso, FINESIM, HSPICE, VERILOG
Responsibilities
Design digital, analog, and memory core circuits using CMOS logic and transistors; Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size; Conduct circuit simulations and analyze power, performance, reliability, and parasitic impacts; Validate builds through reticle experiments, tape-out revisions, and simulation-to-silicon correlation; Prepare and maintain design documentation; Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams; Lead layout and develop resources, track project tasks, and serve as the point of contact for design, layout, verification, and test issues; Prepare project status reports and lead design reviews.
Seniority
Senior, hands-on IC