MATERIAL ENGINEER, ADVANCED PACKAGING TECHNOLOGY DEVELOPMENT
Core
Identify, diagnose, and resolve assembly material-related problems while optimizing processes and equipment for memory and storage manufacturing.
Role type
Senior IC materials engineer (advanced packaging)
Builds
High-performance DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Material evaluation and optimization, Process troubleshooting, Yield improvement, Supplier management, SPC/FDC/RMS/APC support, Site-to-site portability, Audit support
Preferred skills
New product introduction (NPI) validation, Continuous cost reduction, Cross-functional coordination
Technologies
SPC, FDC, RMS, APC
Responsibilities
Identify, diagnose, and resolve assembly material-related problems; Coordinate and execute process, equipment, and material evaluation/optimization initiatives; Lead or participate in continuous yield improvement and cost reduction activities; Validate and fan out new qualified materials, including new processes and tools for NPI; Support SPC/FDC/RMS/APC; Support site-to-site portability; Manage and audit material suppliers to achieve quality, cost, and risk management objectives; Support internal and external audits.