Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Reliability)
Core
Lead a high-performing team to drive intrinsic and extrinsic reliability test development, execution, and DPM reduction for Micron's latest High Bandwidth Memory (HBM) products.
Role type
Principal Engineer / Member of Technical Staff (HBM Product System Engineering)
Builds
HBM DRAM and Interface die products for data centers, AI, and 5G applications
Domain
Semiconductor manufacturing and reliability engineering
Required skills
Root cause analysis (EFA/PFA), reliability test flow development, manufacturing test optimization, cross-functional collaboration, risk management, team leadership, statistics and data analysis, circuit analysis
Preferred skills
Product Engineering experience, process conversion expertise, fab process improvement
Technologies
EFA, PFA, DRAM, HBM, Manufacturing Test Flows
Responsibilities
Define and execute reliability stress test plans; drive DPM reduction through optimized test strategies; debug and resolve qual/RMA failures via failure analysis; recommend fab process conversions for yield and cost improvement; manage risks associated with process conversions; mentor team members; collaborate with Fab, TD, GQ, and Design teams.
Seniority
Principal, hands-on IC with leadership