Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Reliability)
Core
Spearhead and develop a high-performing team driving intrinsic and extrinsic reliability test development and execution for Micron's latest High Bandwidth Memory (HBM) products.
Role type
Principal Engineer / Member of Technical Staff (HBM Product System Engineering)
Builds
HBM products (DRAM and Interface die stacked products) for data centers, AI, and 5G applications
Domain
Semiconductor manufacturing and reliability engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
circuit analysis, root cause analysis, electric failure analysis (EFA), physical failure analysis (PFA), statistics, data analysis, scripting, project management, risk management, cross-functional collaboration
Preferred skills
product engineering experience, manufacturing test flow optimization, fab process conversion expertise
Technologies
DRAM, NAND, NOR memory, HBM, EFA, PFA
Responsibilities
Define and develop reliability stress test flows and plans; drive down extrinsic and intrinsic DPM through optimized manufacturing test flows; debug and identify root causes of qual and RMA failures; provide recommendations to fab teams for new process conversions to reduce cost and increase yields; manage risks associated with DPM process conversions; mentor team members; make final decisions on risk analysis and project prioritization.
Seniority
Principal, hands-on IC with team leadership
