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Staff Engineer, Advanced Development Process and Equipment, Dry Etch

Hiroshima - Fab 15, Japan💼 Full-time🗓 2025-10-29 → 2026-07-31

Core

Developing and optimizing dry etch processes to improve product quality, yield, and reliability in semiconductor manufacturing.

Role type

Staff Process Engineer (Dry Etch)

Builds

High-performance DRAM, NAND, and NOR memory and storage products

Domain

Semiconductor manufacturing / Dry Etch

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

dry etch process expertise, process optimization, yield improvement, failure analysis, FMEA, 8D, SPC/FDC methodology, material supplier management

Preferred skills

Masters/PhD in Engineering, 5+ years semiconductor industry experience, SPC/FDC/RMS/APC systems familiarity

Technologies

SPC, FDC, RMS, APC

Responsibilities

Identify, diagnose, and resolve assembly process related problems; Coordinate and execute process, equipment, and material evaluation/optimization; Lead and participate in continuous yield improvement and cost reduction activities; Validate and fan out new process baselines for new product introduction; Support SPC/FDC/RMS/APC systems; Manage and audit material suppliers to achieve quality, cost, and risk management objectives

Seniority

Staff, hands-on IC with strategic oversight

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