Principal Engineer, HIG-HBM Product Engineering (Media Health Reliability)
Core
Lead a high-performing team to drive intrinsic and extrinsic reliability test development, execution, and DPM reduction for Micron's latest HBM products (DRAM, Interface die, stacked), while optimizing manufacturing test flows and managing process conversions.
Role type
Principal Engineer, HBM Product Engineering (Media Health Reliability)
Builds
High Bandwidth Memory (HBM) products for data centers, AI, and 5G applications
Domain
Semiconductor manufacturing, HBM technology, reliability engineering
Deliverable
production ML models
Required skills
Reliability test flow development, Electric Failure Analysis (EFA), Physical Failure Analysis (PFA), Root cause analysis, Process conversion management, Risk management, Cross-functional collaboration, AI strategy for reliability, Applied machine learning (regression, classification, anomaly detection, clustering), Python scripting, JMP
Preferred skills
Semiconductor device physics, CMOS technology, DRAM architecture, Data analysis and statistics
Technologies
Python, JMP, Claude code, Agentic AI
Responsibilities
Define and develop reliability stress test flows and plans; Execute qualification plans and manage gating issues; Drive DPM reduction through optimized test strategies; Debug and resolve qual/RMA failures via EFA and PFA; Provide recommendations for fab process conversions to improve yield and reduce cost; Manage risks associated with process conversions; Mentor engineers on AI adoption and embed AI/automation into workflows; Make technical decisions on risk analysis and project prioritization; Collaborate with Fab, TD, GQ, Design, and System teams.
Seniority
Principal, hands-on IC with team leadership
