MTS - HBM Thermal Integration Engineer
Core
Drive thermal performance optimization for next-generation High Bandwidth Memory (HBM) products through design, process, packaging, assembly, and test improvements.
Role type
Senior IC thermal integration engineer (semiconductor)
Builds
High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems
Domain
Semiconductor industry, memory and storage solutions, advanced packaging
Deliverable
production ML models
Required skills
Thermal simulation, multiphysics modeling, design of experiments (DOE), data analysis, silicon characterization, process integration, package integration, yield engineering, root-cause investigation, statistical methods, Python, JMP, MATLAB, SQL
Preferred skills
HBM, 2.5D/3D integration, TSV technologies, hybrid bonding, interposers, heterogeneous integration, thermal characterization, variation analysis, cross-functional technology development
Technologies
Ansys, Abaqus, Icepak, FloTHERM, Star-CCM+, Python, JMP, MATLAB, SQL
Responsibilities
Drive thermal performance optimization across HBM products; Develop and implement thermal learning plans and characterization strategies; Analyze silicon characterization and manufacturing data to identify thermal drivers; Partner with simulation teams to improve model correlation; Resolve thermal challenges with fabrication and assembly teams; Identify opportunities to reduce thermal resistance and enhance performance.
Seniority
Senior, hands-on IC