Engineer - Product Yield Enhancement (PFA)
Core
Perform failure analysis activities to identify defect locations, failure mechanisms, and electrical failure modes in memory devices to support root-cause investigations and yield improvement.
Role type
IC physical failure analysis engineer (memory)
Builds
Memory products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Memory
Required skills
Semiconductor device physics, memory architecture, fabrication processes, fault isolation, de-capsulation, circuit edit support, failure characterization, root-cause analysis, laboratory equipment operation
Preferred skills
AI-assisted tool integration, continuous improvement methodologies
Technologies
Analytical tools, laboratory equipment
Responsibilities
Perform failure analysis to identify defect locations and failure mechanisms; Analyze device architecture and fabrication processes to support root-cause investigations; Collaborate with cross-functional teams to present analysis results and support corrective actions; Maintain readiness and effective utilization of laboratory equipment and methodologies; Document technical findings and analysis results.
Seniority
Mid-level, hands-on IC