Principal Engineer, HIG-HBM Design
Core
Design and analyze digital and analog circuits for High Bandwidth Memory (HBM) products, optimizing manufacturing functions and performance for Machine Learning and AI applications.
Role type
Principal Engineer, HIG-HBM Design
Builds
HBM products optimized for power, cost, quality, and reliability
Domain
Semiconductor / Memory / Machine Learning
Deliverable
production ML models
Required skills
High-speed memory design, Power domain network analysis, Memory test architectures, Digital design methodologies, ASIC design development, Memory core timing and signal integrity
Preferred skills
RTL design, synthesis, physical implementation, debugging tests, qualification techniques
Technologies
DRAM circuits, MBIST, RTL, synthesis
Responsibilities
Craft and analyze digital and analog circuits for memory products; Collaborate with global design and verification teams; Innovate and integrate end-to-end front-end and backend processes; Develop lowest power per bit solutions for ML and AI fields.
Seniority
Principal, hands-on IC
