PDE CEM Engineer
Core
Develop and optimize semiconductor assembly processes, new product introductions (NPI), and yield/quality for memory and storage solutions.
Role type
Senior IC process engineer (backend/assembly)
Builds
New product introductions (NPI), engineering samples, and high-volume manufacturing (HVM) transfers for memory/storage packages
Domain
Semiconductor manufacturing, backend assembly, packaging technology
Required skills
Design of Experiments (DOE), statistical analysis, root cause analysis, process optimization, data interpretation, AI proficiency
Preferred skills
Backend engineering process experience, assembly package technology development, materials and equipment knowledge
Technologies
DOE tools, statistical software, AI-enabled workflows
Responsibilities
Execute NPI runs and recipe creation/verification; diagnose and resolve assembly process problems; optimize processes, tools, and materials; develop Process of Record (POR) and define process edges; lead root cause finding and corrective actions for deviations.
Seniority
Mid-level to Senior, hands-on IC
