MTS - Optical Interconnect Design Architect
Core
Define and drive next-generation optical connectivity solutions for future memory, AI accelerator, and high-performance computing platforms.
Role type
Senior IC Optical Interconnect Design Architect
Builds
Scalable optical interconnect solutions for AI, HBM, and chiplet-based systems
Domain
Semiconductor / Silicon Photonics / Optical Interconnects
Required skills
Optical Interconnect Architecture, Silicon Photonics, High-Speed I/O Systems, Optical Communication Systems, Photonic Integrated Circuit (PIC) design, Wavelength Division Multiplexing (WDM/DWDM), Optical link budgeting, Architecture-level tradeoff analysis, Advanced semiconductor packaging (chiplets, hybrid bonding, 2.5D/3D integration)
Preferred skills
AI assisted analysis for architectural tradeoffs, Co-Packaged Optics (CPO), Near-Package Optics (NPO), Optical Interposers
Technologies
Photonic Integrated Circuits (PICs), modulators, detectors, Waveguide technologies, packaging, fiber interfaces, Silicon photonics
Responsibilities
Drive architecture exploration and technology pathfinding bridging electrical I/O with optical interfaces; Define optical interconnect architectures for next-gen memory and AI systems; Lead architectural tradeoff studies across electrical and optical technologies; Develop optical I/O architectures incorporating PICs and silicon photonics; Assess emerging technologies including CPO and NPO; Drive proof-of-concept demonstrations for future HBM and die-to-die optical interconnects
Seniority
Senior, hands-on IC
