HBM EQUIPMENT ENGINEER
Core
Evaluate, improve, and optimize semiconductor assembly manufacturing processes, materials, and equipment to enhance utilization, capacity, and cost.
Role type
Senior IC equipment engineer (semiconductor manufacturing)
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Hardware engineering
Deliverable
production ML models
Required skills
Semiconductor equipment operation and maintenance, DOE/FMEA/OCAP/8D/SPC/Repair/PM techniques, Wafer level molding/dicing/thinning/mount/debond, FDC/Tool alarm analysis, Tool signal analysis (SVID, CEID, ECID), Equipment installation/setup/buyoff procedures, Technical research and literature review
Preferred skills
AI application for equipment performance analysis, Vendor coordination for upgrades and repairs, Design of equipment components
Technologies
Semiconductor assembly tools, FDC systems, SVID/CEID/ECID signals
Responsibilities
Evaluate and improve assigned assembly manufacturing processes, materials, and equipment; Optimize equipment variables and identify performance deviations; Prepare and update equipment operation manuals, maintenance logs, and incident reports; Support the introduction of new equipment and technologies including validation; Coordinate with vendors for equipment upgrades, repairs, and technical support; Conduct regular equipment performance analysis and propose improvements using AI; Locate and research technical information on equipment, materials, and processes.
Seniority
Mid-level, hands-on IC (via careerplan.io/jobs/JR113728-hbm-equipment-engineer-at-micron)