HBM EQUIPMENT ENGINEER
Core
Semiconductor equipment engineer leveraging AI and data analytics to optimize manufacturing yield, reduce downtime, and drive digital transformation in memory and storage production.
Role type
Senior IC equipment engineer (semiconductor manufacturing)
Builds
High-performance DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing / AI-enabled operations (via careerplan.io/jobs/JR113717-hbm-equipment-engineer-at-micron)
Deliverable
production ML models
Required skills
Semiconductor equipment engineering, AI-enabled troubleshooting, data-driven root cause analysis, process validation, supplier quality management, FDC/RMS/APC/SPC systems, predictive maintenance, digital transformation, Microsoft Copilot adoption
Preferred skills
TCB/DB process expertise, advanced analytics tools, generative AI application
Technologies
Microsoft Copilot, Generative AI, FDC, RMS, APC, SPC
Responsibilities
Leverage AI tools to improve equipment utilization and yield performance; utilize AI-powered data analysis to predict failures and optimize maintenance; apply AI-assisted techniques for root cause analysis of equipment alarms; coordinate process and equipment evaluations; lead utilization improvement and smart manufacturing initiatives; validate new processes and technologies for NPI; support FDC/RMS/APC/SPC systems; drive site-to-site best practice transfer; manage supplier quality and risk mitigation.
Seniority
Senior, hands-on IC