MTB ASSEMBLY PROCESS ENGINEER
Core
Establish, monitor, and optimize daily assembly process parameters for semiconductor packaging to ensure stable production lines and drive yield enhancement. (via careerplan.io/jobs/JR113705-mtb-assembly-process-engineer-at-micron)
Role type
Process Engineer (Semiconductor Assembly)
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Packaging
Deliverable
production ML models
Required skills
Statistical Process Control (SPC), Design of Experiments (DOE), Failure Analysis (OM, SEM, EDX, SAT), Root-cause analysis, Standard Operating Procedures (SOP) authoring, JMP/Minitab proficiency
Preferred skills
Wafer Mount, Wafer Singulation, Laser Groove knowledge, Cleanroom environment experience
Technologies
JMP, Minitab, SEM, EDX, SAT
Responsibilities
Monitor and optimize daily assembly process parameters; Lead containment and root-cause analysis of manufacturing defects; Implement SPC to reduce process variation; Author and update SOPs, FMEA, and technical reports; Collaborate with cross-functional teams to resolve technical bottlenecks
Seniority
Junior, entry-level IC