HBM PROCESS ENGINEER
Core
Identify, diagnose, and resolve assembly process problems while optimizing processes, equipment, and materials for new product introductions.
Role type
Semiconductor assembly process engineer (via careerplan.io/jobs/JR113687-hbm-process-engineer-at-micron)
Builds
Memory and storage solutions (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Memory and storage
Deliverable
production ML models
Required skills
Semiconductor assembly process knowledge, Die Bond (DB), Flip Chip (FC), Thermo-Compression Bonding (TCB), SPC/FDC/RMS/APC support, material supplier management, site-to-site portability, AI-powered tool integration, generative AI application for technical documentation and root cause analysis
Preferred skills
Experience in semiconductor assembly processes
Technologies
SPC, FDC, RMS, APC, AI-powered tools, generative AI
Responsibilities
Identify, diagnose, and resolve assembly process related problems; Coordinate and execute process, equipment, and material evaluation and optimization; Lead continuous yield improvement and cost reduction activities; Validate and fan out new process baselines for new product introduction; Support SPC/FDC/RMS/APC; Manage and audit material suppliers; Support internal and external audits; Integrate AI-assisted tools to improve engineering productivity and decision-making
Seniority
Mid-level, hands-on IC