Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory
Core
Define and develop reliability stress test flows and plans for High Bandwidth Memory (HBM) products, driving down defect rates through optimized manufacturing test strategies and root cause analysis.
Role type
Senior IC product reliability engineer (semiconductor manufacturing)
Builds
HBM memory chips and storage products (via careerplan.io/jobs/JR113032-engineer-product-engineering-media-health-reliability-heteregenous-integration-high-bandwi)
Domain
Semiconductor manufacturing / Memory technology
Required skills
Reliability test flow development, Root cause analysis (EFA/PFA), Manufacturing test strategy optimization, Risk management, Cross-functional collaboration, Project management, Technical decision making, AI/automation integration
Preferred skills
Semiconductor device experience, Circuit design, CMOS technology knowledge, DRAM architecture understanding, Data analysis and statistics, Python or JMP scripting
Technologies
Python, JMP, EFA, PFA
Responsibilities
Define reliability stress test flows and plans; Execute qualification plans with Global Quality team; Drive DPM reduction via optimized test strategies; Debug and resolve defectivity and intrinsic reliability issues; Provide recommendations for process conversions to improve yield and cost; Manage risks associated with DPM process conversions; Promote innovation in reliability workflows; Mentor team members; Lead project execution and technical prioritization; Collaborate with Fab, Design, and System teams.
Seniority
Senior, hands-on IC
