Engineer - Product Yield Enhancement (PFA)
Core
Engineer supporting physical failure analysis (PFA) for memory products to identify failure mechanisms and improve yield, quality, and reliability.
Role type
IC physical failure analysis engineer (semiconductor)
Builds
Memory devices (DRAM, NAND, NOR) and storage solutions
Domain
Semiconductor manufacturing / Memory technology
Required skills
physical failure analysis techniques, de-capsulation methods, circuit edit processes, semiconductor device physics, memory architecture, electrical fault isolation, root-cause investigation, defect analysis
Preferred skills
AI-assisted tool integration, continuous improvement methodologies
Technologies
PFA tools, analytical equipment, circuit edit systems
Responsibilities
Perform failure analysis to identify defect locations and failure mechanisms in memory devices; Analyze device architecture and fabrication processes to support root-cause investigations; Collaborate with cross-functional teams to present analysis results and support corrective actions; Maintain readiness and effective utilization of laboratory equipment and failure analysis methodologies; Document technical findings and analysis results in accordance with organizational standards.
Seniority
Mid-level, hands-on IC
