CareerPlan

Sr. Engineer – DRAM Failure Analysis

Boise, Idaho, United States of AmericaFull-time2026-11-05 → 2026-11-10

Core

Perform Electrical and Physical Failure Analysis (EFA/PFA) to investigate defect issues in DRAM memory components, identify root causes, and document findings.

Role type

Senior IC failure analysis engineer (semiconductor manufacturing)

Builds

Defect analysis reports and root cause identification for DRAM yield enhancement

Domain

Semiconductor manufacturing / Memory technology

Required skills

Physical failure analysis (PFA), Data analysis, Scanning Electron Microscopes (SEM), Dual Beam - Focused Ion Beam (FIB), Transmission Electron Microscopes (TEM), Elemental analysis (EELs, EDS), PFA tooling maintenance

Preferred skills

null

Technologies

SEM, FIB, TEM, EELs, EDS

Responsibilities

Monitor probed material and dead die categories, investigate new or unknown defect issues, perform advanced data analysis to support failure analysis results, summarize investigation findings into reports, mentor and assist FA technicians with complex testing and techniques

Seniority

Senior, hands-on IC