Engineer - Product Yield Enhancement (PFA)
Core
Perform physical failure analysis (PFA) on memory devices to identify defects, failure mechanisms, and electrical failure modes, supporting root-cause analysis for yield, quality, and reliability improvements.
Role type
IC physical failure analysis engineer (semiconductor)
Builds
Memory products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Memory
Required skills
Semiconductor device physics, memory architecture, fabrication processes, fault isolation, de-capsulation, circuit edit support, failure characterization, root-cause analysis, laboratory equipment operation, technical documentation
Preferred skills
AI-assisted tool integration, cross-functional collaboration, continuous improvement methodologies
Technologies
Semiconductor failure analysis tools, laboratory analytical equipment
Responsibilities
Perform failure analysis activities to identify defect locations and failure mechanisms; Analyze device architecture and physics to support root-cause investigations; Collaborate with cross-functional teams to present analysis results and support corrective actions; Maintain readiness and effective utilization of laboratory equipment and methodologies; Document technical findings and analysis results; Support continuous improvement activities related to laboratory capability and operational efficiency
Seniority
Mid-level, hands-on IC