Intern - Design Engineer, HBM
Core
Design, analyze, and optimize digital, analog, and memory circuits for High Bandwidth Memory (HBM) products supporting AI and HPC.
Role type
Intern, Design Engineer (HBM)
Builds
High-performance DRAM solutions for AI, HPC, and data-centric applications
Domain
Semiconductor / Memory Technology (via careerplan.io/jobs/JR111821-intern-design-engineer-hbm-at-micron)
Deliverable
production ML models
Required skills
CMOS circuit design, semiconductor device physics, schematic entry, circuit simulation (FineSim/HSPICE), Verilog modeling, scripting (Python/TCL/Perl)
Preferred skills
DRAM architecture, SoC/IO interfaces, AI-Assisted engineering tools
Technologies
FineSim, HSPICE, Verilog, Python, TCL, Perl
Responsibilities
Design and optimize memory/logic/analog circuits; perform circuit verification and parasitic modeling; collaborate with layout and verification teams; support product development ramps; leverage AI tools for design efficiency.
Seniority
Intern
