New College Grad - HBM Design Architect | MS or PhD
Core
Evaluate and develop next-generation High-Bandwidth Memory (HBM) and DRAM architectures for AI, high-performance computing, and cloud infrastructure.
Role type
New graduate Heterogeneous Integration Group (HIG) HBM Design Architect
Builds
Scalable, high-performance semiconductor memory solutions
Domain
Semiconductor / Memory / AI Infrastructure
Deliverable
production ML models | product features
Required skills
CMOS circuits, digital or mixed-signal design, semiconductor devices, computer architecture, memory systems, thermal sciences, signal integrity, power delivery, advanced packaging
Preferred skills
HBM/DRAM/SRAM architecture, 3D integration, engineering simulation (HSPICE, FineSim, Spectre), data analytics, AI/LLMs for engineering
Technologies
HSPICE, FineSim, Spectre
Responsibilities
Analyze HBM/DRAM architectures using models, simulations, and AI-assisted techniques; Develop modeling and simulation methodologies to assess architectural approaches; Collaborate with circuit, layout, packaging, and system teams on feasibility and tradeoffs; Perform root-cause analysis to improve model accuracy and validate assumptions; Communicate technical findings and design recommendations to multidisciplinary teams
Seniority
Junior, New College Graduate