Associate or Senior Product Yield Enhancement Development Failure Analysis Engineer (High Bandwidth Memory)
Core
Perform electrical, physical, and statistical failure analysis on High Bandwidth Memory (HBM) devices to identify root causes, drive corrective actions, and ensure product reliability from design through mass production.
Role type
Senior IC Product Yield Enhancement Development Failure Analysis Engineer (HBM)
Builds
Next-generation HBM products for the semiconductor industry
Domain
Semiconductor manufacturing / High Bandwidth Memory (HBM)
Deliverable
production ML models | product features | dashboards & analysis
Required skills
electrical failure analysis, physical failure analysis, statistical failure analysis, root cause analysis, data analysis, AI tool application, Python programming, semiconductor device physics, VLSI knowledge, semiconductor processing knowledge
Preferred skills
Generative AI tool usage (Copilot, Claude), statistical analysis software (JMP), large-scale data analysis, failure prediction, multidisciplinary technical leadership
Technologies
Python, JMP, Copilot, Claude
Responsibilities
Characterize defects and failure mechanisms in HBM products using electrical, physical, and statistical techniques; Analyze component- and system-level data to resolve root causes; Collaborate with Product, Process, Test, Quality, and Manufacturing Engineering teams; Identify process defects, assembly failures, and test flow marginalities; Support rapid production ramp and product qualification initiatives
Seniority
Senior, hands-on IC