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Principal Engineer Advanced DRAM PI

Boise, ID - Main Site💼 Full-time🗓 2026-08-27 → 2026-09-26

Core

Lead process integration and device development for next-generation Advanced DRAM solutions, transforming concepts into silicon.

Role type

Principal Engineer, Advanced DRAM Process Integration & Device Development

Builds

Advanced DRAM memory architectures and silicon implementations

Domain

Semiconductor manufacturing, Memory technology, Process Integration

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Semiconductor process integration, Device physics, Materials science, Memory technology (DRAM/NAND), Experimental design, Data analysis, Cross-functional project leadership

Preferred skills

Advanced-node memory development, Circuit and architecture considerations, Reliability and failure analysis, Yield improvement, AI-assisted analytics

Technologies

DRAM, NAND, Thin-film transistors (TFTs), Charge storage devices

Responsibilities

Lead process integration efforts for Advanced DRAM technologies, Develop and integrate new memory device architectures from concept through silicon, Design and implement experiments to evaluate device performance and reliability, Partner with cross-functional teams to optimize process flows, Drive yield improvement initiatives through data analysis

Seniority

Principal, hands-on IC with strategy & mentorship

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