Intern - Process & Equipment Engineer (Diffusion)
Core
Intern role focused on improving Poly-SiGe gap fill performance in high aspect ratio structures to enhance die strength and reduce wafer/dice bending.
Role type
Intern, Process & Equipment Engineer (Diffusion)
Builds
Scalable process solutions for semiconductor manufacturing
Domain
Semiconductor manufacturing, materials science, thin-film deposition
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Analytical and problem-solving skills, Machine learning, Statistical analysis, Semiconductor materials knowledge, Thin-film deposition expertise, Process integration knowledge, Materials characterization skills, Design of Experiments (DOE)
Responsibilities
Investigate effects of process parameters on fill depth and gap-fill in HAR structures, Identify process conditions that improve bottom-up fill while maintaining open feature entrances, Identify critical fill characteristics that contribute most to structural robustness, Recommend optimized window and qualification plan, Perform DOE and experimental matrix with SEM/TEM cross-section analysis, Correlate fill quality with die-strength/block-bending performance
