Sr. Product Development Engineer
Core
Managing Chip-Package-Interaction (CPI) issues for DRAM memory products from pathfinding through high-volume manufacturing, including package program planning and end-to-end reviews.
Role type
Senior Product Development Engineer (DRAM)
Builds
DRAM memory devices and packages for the semiconductor industry
Domain
Semiconductor manufacturing, specifically DRAM memory and backend-of-line (BEOL) processes
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DRAM/NAND memory device structure and function, Chip-package-interaction (CPI) assembly process understanding, DRAM/NAND device/package design, Wafer Probe and Test flow analysis, memory array and back-end-of-line fabrication processes, CPI quality and reliability degradation mechanisms
Responsibilities
Establish package program plans for new DRAM fab technology process nodes, coordinate DRAM device/package/module end-to-end reviews, incorporate device design features into CPI and packaging risk assessments, correlate electrical failures to CPI physical defects, design effective quality and reliability qualification plans
Seniority
Senior, hands-on IC