PDE HBM Yield Engineering
Core
Account for HBM NPI builds across PWF, Assembly, and test through defect breakdown and PFA submission to understand fail modes; analyze yield deviations and trigger actions from process integration, process engineering, or RDA teams; brainstorm and propose yield improvement opportunities using data-driven problem solving and AI-assisted tools.
Role type
Yield Engineering Engineer (HBM NPI)
Builds
HBM memory products (DRAM, NAND, NOR) for data centers, AI applications, and mobile user experiences
Domain
Semiconductor manufacturing (memory and storage solutions)
Deliverable
production ML models | product features | dashboards & analysis
Required skills
yield analysis, defect breakdown, PFA submission, SPC/FDC chart interpretation, data analysis, statistics, AI tool integration
Preferred skills
Auto-diagnostics software usage, shift left monitoring, continuous improvement methodologies
Technologies
Auto-diagnostics, SPC, FDC, yield dashboards
Responsibilities
Account for HBM NPI builds across PWF, Assembly, and test through defect breakdown and PFA submission; analyze and report on yield deviation issues and trigger actions from PI, PE, or RDA; utilize software tools like Auto-diagnostics to find yield improvement opportunities; integrate AI-assisted tools into daily work to improve efficiency and quality
Seniority
Entry to Mid-level, hands-on IC
