Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory
Core
Define and develop reliability stress test flows and plans for High Bandwidth Memory (HBM) products, driving down defect rates through optimized manufacturing test strategies and root cause analysis.
Role type
Senior IC reliability engineer (semiconductor manufacturing)
Builds
HBM products for data centers, AI, and high-performance computing
Domain
Semiconductor manufacturing / Memory technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
semiconductor device physics, CMOS technology, DRAM architecture, root cause analysis, electric failure analysis (EFA), physical failure analysis (PFA), statistical data analysis, Python scripting, JMP, project management, cross-functional collaboration
Preferred skills
experience in semiconductor devices, circuit design, product validation, AI/ML for reliability testing, process conversion optimization
Technologies
Python, JMP, EFA tools, PFA tools, AI platforms (Claude code, agentic AI)
Responsibilities
Define and develop reliability stress test flows and qualification plans; drive down Extrinsic and Intrinsic Reliability (DPM) through optimized manufacturing test strategies; debug and identify root causes of device failures using EFA and PFA; provide recommendations to fab teams for new process conversions to improve yield and quality; manage risks associated with DPM process conversions; promote innovation in reliability testing methodologies; mentor team members; make technical decisions on risk analysis and project prioritization; collaborate with Fab, HBM Technology, Design, and Quality teams.
Seniority
Senior, hands-on IC
