Wet Process, CMP and Bond MDE Principal Lead Engineer
Core
Leading a team responsible for wet process, CMP, and bonding development execution to accelerate DRAM technology learning and roadmap delivery.
Role type
Principal Lead Engineer (Process Development)
Builds
Next-generation DRAM technology
Domain
Semiconductor manufacturing (Memory/Storage)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
People leadership, technical direction, shift operations management, workflow improvement, AI adoption, problem-solving, cross-functional collaboration
Preferred skills
Semiconductor process development experience, deep expertise in core process areas, shift-based manufacturing experience, mentoring emerging engineers, leveraging AI/Generative AI
Technologies
AI, Generative AI
Responsibilities
Lead multi-functional execution of process development priorities, drive wafer movement and data quality, lead 24/7 shift operations, mentor and develop engineers, improve workflows and AI adoption
Seniority
Principal, hands-on IC with leadership