ENGINEER, APTD FILM process
Core
Drive HBM process development and yield improvement in FILMs (CVD, PVD) processes for advanced packaging (chip stacking, 2.5D/3D).
Role type
Process Engineer (Thin Film Deposition)
Builds
High-bandwidth memory (HBM) and advanced packaging solutions
Domain
Semiconductor manufacturing / Memory and storage
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Thin film deposition principles, FILMs process characteristics (uniformity, stress, adhesion, step coverage, defect behavior), root cause analysis, materials characterization, cross-team coordination, supplier management
Preferred skills
Tool hands-on experience with CVD/PVD production tools (AMAT, LAM, TEL), PhD in relevant field
Technologies
CVD, PVD, AMAT, LAM, TEL
Responsibilities
Drive HBM process development and yield improvement; Assist advanced package technology research and development; Support project on-site execution as technical consultant; Troubleshoot complex problems and perform root cause analysis; Generate internal and external technical documentation; Coordinate mechanical characterization globally; Provide recommendations for test structure and vehicle design; Review and present data with recommendations to packaging material suppliers
Seniority
Mid-level, hands-on IC
