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Engineer, CMP Process Development R&D

Boise, ID - Main Site💼 Full-time🗓 2026-05-19 → 2026-07-31

Core

Identify, diagnose, and resolve assembly process problems while optimizing semiconductor manufacturing processes and materials.

Role type

Senior IC process development engineer (semiconductor)

Builds

New product introductions and optimized assembly processes for memory and storage solutions

Domain

Semiconductor manufacturing / Materials Science

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Design of experiments, complex dataset analysis, semiconductor hardware operation, chemical property analysis, supplier gap identification

Preferred skills

Continuous yield improvement, cost reduction, site-to-site portability, SPC/FDC/RMS/APC support

Technologies

SPC, FDC, RMS, APC

Responsibilities

Coordinate and execute process, equipment, and material evaluation/optimization initiatives; Lead or participate in continuous yield improvement and cost reduction activities; Validate and fan out new process baselines for new product introduction; Manage and audit material suppliers for quality, cost, and risk management objectives; Support internal and external audits

Seniority

Mid-level, hands-on IC

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