CareerPlan

Application Engineer

Shanghai, CNRemoteFull-time2026-10-16 → 2026-11-10
Hybrid

Core

Application Engineer responsible for developing customer-specific bonding process solutions and integrating them into production.

Role type

Application Engineer (Process Engineering)

Builds

Customer-specific bonding process solutions integrated into production

Domain

Semiconductor/Microelectronic manufacturing

Required skills

Process engineering, Mechanical engineering, Electrical engineering, Physics, Laser technology, Microelectronics, Semiconductor technology, Feasibility studies, Technical consultation, Cross-departmental collaboration

Preferred skills

Laser technology, Microelectronics, Semiconductor technology

Technologies

Laser, Microelectronics, Semiconductor

Responsibilities

Handling complex bonding processes from disparate markets, Developing customer-specific solutions to the point of process integration, Supporting market processing with technical consultation for customers in China, Conducting feasibility studies and presenting results

Seniority

Mid-Senior, hands-on IC