CareerPlan

Senior Substrate Engineer

Taiwan, TaipeiFull-time2026-10-21 → 2026-11-10
Hybrid

Core

Develop, optimize, and integrate cutting-edge processes to improve performance, yield, and reliability of substrates used in semiconductor packaging.

Role type

Senior Process Integration Development Engineer (substrate manufacturing)

Builds

Advanced substrate packaging solutions for Intel

Domain

Semiconductor manufacturing and packaging

Required skills

process integration, substrate development, process characterization (SEM, AFM, X-ray), data analysis, technology transfer, documentation

Preferred skills

statistical process control (SPC), design of experiments (DOE), quality improvement methods, high-volume manufacturing experience

Technologies

SEM, AFM, X-ray

Responsibilities

Develop and optimize process integration methodologies, collaborate with cross-functional teams, evaluate and implement new materials/tools, troubleshoot process issues, support technology transfer and ramp-up, document process development efforts

Seniority

Senior, hands-on IC