Module Engineer for Assembly Department
Core
Manage and optimize high-volume manufacturing equipment and processes for integrated circuit production, focusing on device miniaturization and yield improvement.
Role type
Module Engineer (Assembly Department)
Builds
Integrated circuits via high-volume assembly and packaging processes
Domain
Semiconductor manufacturing / Electronics assembly
Required skills
Semiconductor packaging, SMT assembly, BGA package assembly, Yield improvement, Quality engineering, Manufacturing problem-solving, FMEA, SPC, Data analysis, Scripting/Programming
Preferred skills
Automated inspection systems, Vision-based manufacturing, Six Sigma, DMAIC, 8D, Statistical Process Control, Automation scripting, Industrial imaging hardware, Process Metallurgy, Joint Reliability
Technologies
JMP, SQL, Power BI, Python, AutoCAD, Solidworks, SPI, Reflow ovens, Cleaning modules, 2D/3D Metrology
Responsibilities
Manage critical high-volume manufacturing equipment and processes; Conduct tests and measurements for critical dimensions and defectivity; Recommend and implement modifications to optimize production; Execute maintenance and repair activities; Drive continuous improvement for safety, quality, cost, and yield; Collaborate with equipment suppliers; Develop systems for excursion prevention; Participate in technology transfer and audits; Lead equipment installation and qualification.
Seniority
Mid-level (1–3 years experience)
