Packaging Module Development Engineer
Core
Develops and sustains metrology systems, measurement methods, and inspection equipment to support process control, yield improvement, and manufacturability for Thermal Compression Bonding (TCB) and advanced packaging technologies.
Role type
Senior IC metrology equipment engineer (semiconductor manufacturing)
Builds
Measurement solutions for process control, product qualification, and reliability evaluation in semiconductor manufacturing
Domain
Semiconductor manufacturing / Advanced packaging / Metrology
Required skills
measurement system analysis (MSA), electrical measurements and test, optical metrology, data analysis tools (Python, SQL, Excel), statistical analysis, design of experiments (DOE), equipment qualification, calibration methods, lab-to-factory correlation (via careerplan.io/jobs/JR0286214-packaging-module-development-engineer-at-intel)
Preferred skills
semiconductor manufacturing experience, machine vision systems, automated inspection, tool matching studies, supplier management, root cause analysis of measurement variation
Technologies
Python, SQL, Excel, microscopes, imaging systems, machine vision systems
Responsibilities
Optimize metrology capability across laboratory and manufacturing environments; use statistical analysis to improve repeatability and reproducibility; establish measurement specifications and collaborate with internal teams; provide technical consultation on measurement challenges; support standardization of metrology methods
Seniority
Senior, hands-on IC