Back End( BE) Process Integration Engineer
Core
Develop and define integrated front-end and back-end process flows for new technology nodes to drive Intel's product roadmap.
Role type
Senior IC process integration engineer (semiconductor manufacturing)
Builds
New technology nodes and advanced interconnect stacks for high-volume manufacturing
Domain
Semiconductor manufacturing / Process Technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
PhD in EE/Physics/Materials Science, cleanroom experience, BEOL integration, advanced interconnect metallization, electrical characterization, statistical analysis (SPC/DOE/FMEA), root cause analysis, process optimization, SOP documentation
Preferred skills
RC delay/emigration/TDDB knowledge, JMP/Python/MATLAB/TCL scripting, dry etch/ALD/PECVD/CMP experience, experiment design, defect classification systems familiarity, cross-functional influence
Technologies
JMP, Python, SQL, MATLAB, JSL, TCL, KLA tools, Applied Materials review tools, SPC, DOE, FMEA
Responsibilities
Develop integrated front-end and back-end process flows; Coordinate across lithography, etch, deposition, and metrology teams; Optimize RC performance; Analyze yield loss and parametric failures; Drive corrective actions to improve yield and cycle time; Support ramp from R&D to high-volume manufacturing; Document process specifications and SOPs
Seniority
PhD level, hands-on IC
