Package Failure Analysis Engineer
Core
Determine root cause of assembled package yield loss and in-line failures through hands-on lab work, fault isolation, and defect characterization.
Role type
Package Failure Analysis Engineer
Builds
Advanced packaging solutions for compute devices
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
electrical fault isolation, defect characterization, data acquisition strategy, data analysis, corrective action recommendation, failure analysis techniques, process improvement consultation
Preferred skills
optical analysis (SEM, TEM, x-ray, microscopy), electrical circuit fundamentals, chemical compositional analysis (EDX, AFM, FTIR, Raman, XRD, EBSD), CAD software, statistical analysis (JMP)
Responsibilities
Conduct hands-on lab work and engineering tests to isolate electrical failures; define data acquisition and analysis plans; develop innovative failure analysis techniques; provide consultation on packaging and assembly problems; respond to customer requests and events; bridge support between shift engineering technicians and module partners.
Seniority
Entry-level (College Grad)
