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Thermal data Analysis Engineer

US, Arizona, Phoenix💼 Full-time💰 $164,470–$232,190🗓 2026-06-04 → 2026-07-30

Core

Drive thermal design and analysis for GPU, AI accelerators, and data center products through simulation and experimental work to ensure thermal requirements are met across silicon, package, and platform levels.

Role type

Thermal data Analysis Engineer

Builds

High-performance computing solutions (GPU, AI accelerators, data center products)

Domain

Semiconductor / High-performance computing / Thermal management

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Thermal simulation (CFD, FEA), thermal characterization, experimental testing, heat transfer principles, thermal metrology, data correlation, prototype development, statistical analysis

Preferred skills

Advanced cooling technologies (immersion, two-phase, microchannel, liquid), thermal instrumentation, rapid testing methodologies, power electronics, energy efficiency concepts

Technologies

Computational Fluid Dynamics (CFD), Finite Element Analysis (FEA), thermocouples, infrared cameras, flow meters

Responsibilities

Develop thermal design strategies for advanced packaging technologies (chiplets, multi-chip modules), design and execute experiments to characterize thermal performance, correlate experimental data with simulation results, partner with silicon design and system engineering teams to ensure thermal compliance

Seniority

Mid-level IC (2+ years experience)

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