Thermo Mechanical Engineer
Core
Lead the design of advanced cooling architectures for high-density AI accelerator systems destined for data centre deployment.
Role type
Senior Thermal Engineer (Hardware)
Builds
Direct-to-Chip (D2C) liquid cooling systems, cold plates, CDUs, and hybrid liquid-air chassis for AI hardware.
Domain
AI hardware / High-performance computing / Data centre infrastructure
Deliverable
production ML models | product features | infrastructure
Required skills
D2C liquid cooling design, cold plate design, CDU/rack-level system design, thermal modelling and simulation, prototyping and test rig development, supplier management, thermal-fluid analysis, materials selection, system reliability principles
Preferred skills
AI accelerator or HPC hardware experience, mechanical chassis design and integration, data centre operator or hyperscale infrastructure experience, liquid handling and serviceability knowledge
Technologies
Thermal modelling and simulation tools
Responsibilities
Lead design and specification of cooling solutions for dense AI hardware, collaborate with suppliers to define thermal/mechanical requirements, contribute to mechanical system design (chassis interfaces, manifold routing), model and simulate thermal performance at multiple levels, develop/oversee test platforms for validation, drive design reviews and evaluate trade-offs, liaise with system and hardware teams for integration
Seniority
Senior, hands-on IC