MTS - Advanced Packaging 2.5D and Deep Trench Integration Engineer
Core
Drive integration activities for 2.5D solutions and deep trench (DT) technologies from early process development through manufacturing readiness.
Role type
Advanced Packaging Integration Engineer
Builds
2.5D module interfaces, deep trench process modules, and package-level integration solutions
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
semiconductor process integration, deep trench structures, silicon interposers, TSVs, redistribution layers, wafer thinning, bonding, process control, reliability analysis, yield improvement, root-cause analysis, DOE design
Preferred skills
deep trench capacitor/isolation integration, high-aspect-ratio silicon structures, advanced packaging process flows, semiconductor metrology, failure analysis, statistical data analysis
Technologies
deep trench etch, dielectric formation, electrode fill, planarisation, thermal processing, electrical characterisation, assembly flows
Responsibilities
Translate product requirements into integration plans and experiments; integrate deep trench process modules; execute test structures and structured DOEs; analyze physical, electrical, and reliability data; resolve integration issues with cross-functional teams; develop integration documentation and present technical findings
Seniority
Mid-Senior, hands-on IC
