Engineer Packaging Test Engineering
Core
Test engineer supporting electrical test, product characterization, and yield-learning for 2.5D/3D heterogeneous integration technologies including chiplet-based packages, interposers, TSVs, and hybrid bonding.
Role type
Entry-level IC test engineer (advanced packaging)
Builds
Advanced packaging test vehicles, wafers, dies, and interposers for 2.5D/3D integration
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Electrical measurements, circuit analysis, data interpretation, statistical analysis, problem-solving, documentation, cross-functional collaboration
Preferred skills
ATE operation, wafer probing, package final test, test-program development, statistics/DOE, advanced packaging awareness, signal/power/thermal integrity knowledge
Technologies
Python, JMP, MATLAB, Excel, oscilloscopes, source-measure units, parameter analyzers, digital multimeters
Responsibilities
Develop and validate electrical test methods, execute characterization experiments, troubleshoot test hardware (probe cards, sockets), analyze test data for yield loss, support failure isolation, assist in process/product qualification, maintain test documentation
Seniority
Entry-level, hands-on IC
