Principal Engineer Process Engineering
Core
Develop, optimize, and troubleshoot unit processes for 300mm advance packaging (bond/debond, pre-bond, die re-constitution, annealing, TSV) on multi-stack bond wafer and Die-to-Wafer processes.
Role type
Principal Process Engineer (Advanced Packaging)
Builds
Advanced packaging processes and tools for high-volume manufacturing
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
DOE techniques, statistical process control, root cause analysis, equipment qualification, process robustness improvement, yield optimization, lean manufacturing, Six Sigma, technical coaching
Preferred skills
Experience with TEL W2W/BESI D2W and Alpha 303/Mattson Helios tools, CIP program facilitation
Technologies
TEL W2W, BESI D2W, TEL Alpha 303, Mattson Helios
Responsibilities
Design and execute experiments for advanced packaging etch processes; startup and qualify new processes and equipment; improve process robustness using statistical tools; resolve complex technical and yield issues; coach and develop other engineers; facilitate CIP programs to optimize process window and yield
Seniority
Senior, hands-on IC