Low-Temperature Bonding Engineer
Core
Develop low-temperature bonding processes and support advanced die assembly technologies for next-generation superconducting and cryogenic quantum packaging platforms.
Role type
R&D assembly engineer (quantum packaging)
Builds
Quantum packaging platforms and advanced assembly equipment
Domain
Semiconductor manufacturing / Quantum computing / Cryogenics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
low-temperature bonding process development, BEOL processes and integration, bump/wafer finish integration, wafer test/probe, OSAT collaboration, package development & assembly, design of experiment (DOE), process characterization, tool optimization, defect reduction, cryogenic reliability testing, electrical and RF/microwave integrity analysis, high-precision alignment tool definition
Preferred skills
MS degree, project management, innovation in ambiguous environments, technical leadership, mentoring
Technologies
thermo-compression bonding, hybrid bonding, superconducting metal bonding, cryogenic materials handling
Responsibilities
Develop and optimize low-temperature bonding processes for quantum packaging applications, Support assembly process development including In bonding and hybrid bonding, Characterize bond quality and electrical performance under cryogenic conditions, Define process windows and critical-to-quality parameters, Own assembly process modules from development through qualification, Execute process experiments and DOE activities to improve process capability, Mentor new hires and support team hiring
Seniority
Mid-level IC (4+ years experience)
