Microelectronics Manufacturing and Process Engineer
Core
Lead advanced microelectronics assembly in an ISO Class 7 cleanroom, developing novel solutions for ruggedized miniature electro-mechanical systems and autonomous systems for harsh environments.
Role type
Senior IC Packaging Process Engineer
Builds
Custom microelectronics packaging (ceramic LCCs, flatpacks, CQFP, TSOP, ASICs, multichip modules) and ruggedized electro-mechanical systems
Domain
Defense, space exploration, biomedical engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wire bonding (gold & aluminum), die attach (epoxy, eutectic solder), lid sealing (solder, seam welding, projection welding), DOE, SPC, FMEA implementation, CAD design, QML Q and V level inspections
Preferred skills
6S Green or black belt, experience with FOWLP, 2.5DIC, 3DIC
Technologies
Die Bonders, Wire bonders, Seam Welders, CAD programs
Responsibilities
Lead cleanroom assemblers ensuring compliance with strict quality standards, assemble custom packaging, train and certify new employees in cleanroom processes, conduct QML Q and V level inspections, oversee manufacturing and production process to set standards, identify program/system-level technical risks and develop mitigation strategies
Seniority
Senior, hands-on IC
